CHO-BOND 1075 (2.5 OZ KIT)
Chobond 1075 is an electronically conductive, one component silicone adhesive/ sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk. Minimum recommended bond line for CHO-BOND 1075 is 0.010 in (0.25 mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion-resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075's moisture cure silicone polymer system allows it to cure to the touch in 24 hr and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles and shelters.
FEATURES:
➢ One-component
➢ Silver-plated aluminum filler
➢ No VOCs
➢ Moisture cure silicone
➢ Light-weight
➢ Non-corrosive cure mechanism
➢ Dry medium paste
➢ Easy-to-use, no weighing or mixing required
➢ Excellent conductivity 0.01 ohm-cm outstanding galvanic corrosion-resistance against aluminum substrates
➢ Minimal shrinkage
➢ 15 min work life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure
➢ More coverage per gram of material, minimal weight added to assembly or vehicle
➢ No corrosive by-products generated during curing to damage substrate
➢ Can be used on overhead or vertical surfaces
Tags: CHO-BOND® 1075 Gray Corrosion Resistant Electrically Conductive Sealant - 2.5 oz Kit